Microchip Technology Humidity Sensor PICtail Dokumentacja Strona 113
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105
Characteristic Impedance
Z
o
= impedance of an infinitely long line (in ohms)
R = resistance (in ohms)
L = inductance (in H)
G = conductivity per unit length of line (in mhos)
C = capacitance (in F)
A microstrip is an electric medium that can be made using a PCB. The cross
sectional surface representation of a microstrip can be divided up into 4
components. These components are the conductor, the upper dielectric,
dielectric substrate, and the ground plane. Some drawbacks to the microstrip are
that they have minimal power handling capacity and high losses. Figure 52 is an
illustration of the linear geometric depiction of a microstrip being fabricated on a
PCB.
Figure 52 Microstrip Layout on a PCB
A is known as the top conductor, B is the upper dielectric medium, C is defined
as the dielectric substrate or level between the dielectric and the conductor, D is
referred to as the ground plane
Illustrated below is the method to calculate the characteristic impedance of a
microstrip line. The impedance of the microstrip line is altered with the frequency
of the material being used. The quasi-static characteristic impedance can affect
how the frequency rises or falls for the substrate.
Characteristic Impedance for a Microstrip
h = dielectric thickness
W = microstrip width
E
r
= substrates dielectric constant
4.3 Main Control Unit
Our design calls for the main control unit to be powered by a 24V AC common
wire that is installed in the building during the initial construction project. The
advantage of this design is that the main control unit will run as long as there is
power being delivered to the building. The alternative method of powering the
- Table of Contents 3
- Table of Figures 6
- Table of Tables 7
- 1.1 Executive Summary 9
- 1.2 Motivation 10
- 1.3 Objective 12
- 1.3.1 Remote Sensing Unit 12
- 1.3.2 Main Control Unit 13
- 1.4.2 Detailed Requirements 14
- 1.5.1 Division of Labor 16
- 1.5.2 Coding Breakdown 18
- 1.6 Block Diagrams 20
- 1.7 Timelines and Milestones 21
- 1.8 Budget / Finances 24
- Section 2: Research 26
- 2.1 Research Methods 26
- 2.2 Main Microcontroller 27
- Input / Output Ports: 28
- Memory Type: 29
- Development tools: 29
- Instructions 30
- 2.2.1 General Description 31
- 2.2.2 Pins 34
- 2.2.3 Interfacing 36
- 2.5 LCD Touch Screen 43
- 2.6 Wireless Interfacing 47
- 2.6.2 Wireless Protocols 48
- 2.6.3 IEEE 802.15.4 – ZigBee 49
- 2.6.4 Bluetooth 50
- 2.6.5 IEEE 802.11 – Wi-Fi 51
- 2.7 Smart Phone Application 53
- 2.7.1 Remote Access 53
- 2.7.2 TCP/IP 54
- 2.7.3 Host-to-Network Layer 54
- 2.7.4 Internet Layer 55
- 2.7.5 Transport Layer 55
- 2.7.6 Application Layer 56
- 2.7.7 Microchip TCP/IP Stack 56
- 2.7.8 Implementation 57
- 2.7.9 Microchip HTTP Server 63
- 2.7.10 Implementation 63
- 2.8 MPFS 66
- 2.9 Mobile Web Site 68
- 2.10 iPhone App 68
- 2.12 Power 70
- User Interface 70
- 2.12.2 Remote Sensing Unit 70
- 2.13 Batteries 71
- 2.15 Dampers 73
- Approx. 4' 74
- 18" 75
- 12" 75
- 24" 75
- 2.16 Sensors 76
- 3.5" 77
- 82
- Wireless Sensor 83
- (MRF24WB0MA) 86
- Sensor 89
- 3.3.1 Sensirion SHT21 89
- C Protocol 90
- 3.5 SLCD5 Controller 95
- Processor 97
- 3.5.2 Touch Interface 98
- Program 98
- Description 99
- Command 99
- Arguments 99
- 3.6 Design Summary 102
- Main Control Unit 103
- Main Control System 105
- Secondary 106
- Microcontroller 106
- 4.1.2 Microchip 108
- Section 4: Prototype 108
- 4.1 Vendors 108
- 4.1.1 Reach Technology Inc 108
- 4.1.3 Sensirion 109
- 4.2 Printed Circuit Board 109
- 4.4 Remote Sensing Unit 116
- 4.5 Relays 117
- 4.6 Demonstration 119
- Section 5: Testing 121
- Daughter Board 123
- 5.4 Safety Considerations 125
- 5.5 Equipment 126
- 5.6 Environment 127
- 5.7.1 Final Specifications 127
- 5.7.2 Final Requirements 128
- Bibliography 135
- *Subject of your message: 140
- *Message: 141
- Reach Technology Permission: 143
- Microchip Permssion: 144
- Contact Us 145
- Thanks very much 146
- 727-580-6767 147
- Abbreviations and Acronyms 149
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